? semiconductor components industries, llc, 2012 july, 2012 ? rev. 3 1 publication order number: nlu2g16/d nlu2g16 dual non-inverting buffer the nlu2g16 minigate is an advanced high ? speed cmos dual non ? inverting buffer in ultra ? small footprint. the nlu2g16 input and output structures provide protection when voltages up to 7.0 v are applied, regardless of the supply voltage. features ? high speed: t pd = 3.5 ns (typ) @ v cc = 5.0 v ? low power dissipation: i cc = 1 a (max) at t a = 25 c ? power down protection provided on inputs ? balanced propagation delays ? overvoltage tolerant (ovt) input and output pins ? ultra ? small packages ? these are pb ? free devices out y1 in a2 in a1 out y2 gnd 1 2 3 5 4 in a2 out y2 1 figure 1. pinout (top view) figure 2. logic symbol 6 v cc in a1 out y1 1 pin assignment 1 2 3in a2 in a1 gnd 4 5v cc out y2 function table l h ay l h 6 out y1 marking diagrams c or 4 = device marking m = date code http://onsemi.com see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information 1 udfn6 1.2 x 1.0 case 517aa 1 1 1 ullga6 1.0 x 1.0 case 613ad ullga6 1.2 x 1.0 case 613ae ullga6 1.45 x 1.0 case 613af cm cm 4 m c m udfn6 1.45 x 1.0 case 517aq udfn6 1.0 x 1.0 case 517bx 1 x m 1 x m
nlu2g16 http://onsemi.com 2 maximum ratings symbol parameter value unit v cc dc supply voltage ? 0.5 to +7.0 v v in dc input voltage ? 0.5 to +7.0 v v out dc output voltage ? 0.5 to +7.0 v i ik dc input diode current v in < gnd ? 20 ma i ok dc output diode current v out < gnd 20 ma i o dc output source/sink current 12.5 ma i cc dc supply current per supply pin 25 ma i gnd dc ground current per ground pin 25 ma t stg storage temperature range ? 65 to +150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v ? 0 @ 0.125 in i latchup latchup performance above v cc and below gnd at 125 c (note 2) 500 ma stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. measured with minimum pad spacing on an fr4 board, using 10 mm ? by ? 1 inch, 2 ounce copper trace no air flow. 2. tested to eia / jesd78. recommended operating conditions symbol parameter min max unit v cc positive dc supply voltage 1.65 5.5 v v in digital input voltage 0 5.5 v v out output voltage 0 5.5 v t a operating free ? air temperature ? 55 +125 c t/ v input transition rise or fall rate v cc = 3.3 v 0.3 v v cc = 5.0 v 0.5 v 0 0 100 20 ns/v
nlu2g16 http://onsemi.com 3 dc electrical characteristics symbol parameter conditions v cc (v) t a = 25 c t a = +85 c t a = ? 55 c to +125 c unit min typ max min max min max v ih low ? level input voltage 1.65 0.75 x v cc 0.75 x v cc v 2.3 to 5.5 0.70 x v cc 0.70 x v cc v il low ? level input voltage 1.65 0.25 x v cc 0.25 x v cc 0.25 x v cc v 2.3 to 5.5 0.30 x v cc 0.30 x v cc 0.30 x v cc v oh high ? level output voltage v in = v ih or v il i oh = ? 50 a 2.0 3.0 4.5 1.9 2.9 4.4 2.0 3.0 4.5 1.9 2.9 4.4 1.9 2.9 4.4 v v in = v ih or v il i oh = ? 4 ma i oh = ? 8 ma 3.0 4.5 2.58 3.94 2.48 3.80 2.34 3.66 v v ol low ? level output voltage v in = v ih or v il i ol = 50 a 2.0 3.0 4.5 0 0 0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v v in = v ih or v il i ol = 4 ma i ol = 8 ma 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 i in input leakage current 0 v in 5.5 v 0 to 5.5 0.1 1.0 1.0 a i cc quiescent supply current 0 v in v cc 5.5 1.0 10 40 a ac electrical characteristics (input t r = t f = 3.0 ns) symbol parameter v cc (v) test condition t a = 25 c t a = +85 c t a = ? 55 c to +125 c unit min typ max min max min max t plh , t phl propagation delay, input a to output y 3.0 to 3.6 c l = 15 pf 4.5 7.1 8.5 10 ns c l = 50 pf 6.4 10.6 12 14.5 4.5 to 5.5 c l = 15 pf 3.5 5.5 6.5 8.0 c l = 50 pf 4.5 7.5 8.5 10 c in input capacitance 4.0 10 10 10 pf c pd power dissipation capacitance (note 3) 5.0 8.0 pf 3. c pd is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. average operating current can be obtained by the equation i cc(opr) = c pd ? v cc ? f in + i cc . c pd is used to determine the no ? load dynamic power consumption: p d = c pd ? v cc 2 ? f in + i cc ? v cc.
nlu2g16 http://onsemi.com 4 switching waveforms figure 3. switching waveforms y *includes all probe and jig capacitance c l * test point device under test output figure 4. test circuit 50% 50% v cc v cc gnd t plh t phl a ordering information device package shipping ? nlu2g16mutcg udfn6, 1.2 x 1.0, 0.4p (pb ? free) 3000 / tape & reel nlu2g16amx1tcg ullga6, 1.45 x 1.0, 0.5p (pb ? free) 3000 / tape & reel nlu2g16bmx1tcg ullga6, 1.2 x 1.0, 0.4p (pb ? free) 3000 / tape & reel nlu2g16cmx1tcg ullga6, 1.0 x 1.0, 0.35p (pb ? free) 3000 / tape & reel NLU2G16AMUTCG udfn6, 1.45 x 1.0, 0.5p (pb ? free) 3000 / tape & reel nlu2g16cmutcg udfn6, 1.0 x 1.0, 0.35p (pb ? free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
nlu2g16 http://onsemi.com 5 package dimensions udfn6 1.45x1.0, 0.5p case 517aq issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 6x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view 1 3 4 6 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 b 0.20 0.30 d 1.45 bsc e 1.00 bsc e 0.50 bsc l 0.30 0.40 l1 ??? 0.15 dimensions: millimeters 0.30 6x 1.24 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.50 1 mounting footprint package outline l1 detail a l optional constructions l 0.07 ref 6x a2 detail b detail a
nlu2g16 http://onsemi.com 6 package dimensions udfn6 1.0x1.0, 0.35p case 517bx issue o ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* recommended dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.12 0.22 d 1.00 bsc e 1.00 bsc e 0.35 bsc l 0.25 0.35 l1 0.30 0.40 a b e d 0.10 c pin one reference top view 0.10 c a a1 0.05 c 0.05 c c seating plane side view 2x 2x a3 bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 l1 1 3 4 6 m m dimensions: millimeters 0.22 5x 0.48 6x 1.18 0.53 pitch 0.35 1 pkg outline
nlu2g16 http://onsemi.com 7 package dimensions udfn6, 1.2x1.0, 0.4p case 517aa issue c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 2x 0.10 c pin one reference top view 2x 0.10 c 10x a a1 (a3) 0.08 c 0.10 c c seating plane side view l2 1 3 4 6 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.127 ref b 0.15 0.25 d 1.20 bsc e 1.00 bsc e 0.40 bsc l 0.30 0.40 l1 0.00 0.15 l1 detail a bottom view (optional) 0.40 0.50 mounting footprint* dimensions: millimeters 0.22 6x 0.42 6x 1.07 0.40 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
nlu2g16 http://onsemi.com 8 package dimensions ullga6 1.0x1.0, 0.35p case 613ad issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view l1 1 3 4 6 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.12 0.22 d 1.00 bsc e 1.00 bsc e 0.35 bsc l 0.25 0.35 l1 0.30 0.40 note 4 soldermask defined* dimensions: millimeters 0.22 5x 0.48 6x 1.18 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.35 1 mounting footprint pkg outline
nlu2g16 http://onsemi.com 9 package dimensions ullga6 1.2x1.0, 0.4p case 613ae issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view l1 1 3 4 6 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.15 0.25 d 1.20 bsc e 1.00 bsc e 0.40 bsc l 0.25 0.35 l1 0.35 0.45 note 4 soldermask defined* dimensions: millimeters 0.26 5x 0.49 6x 1.24 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.40 1 mounting footprint pkg outline
nlu2g16 http://onsemi.com 10 package dimensions ullga6 1.45x1.0, 0.5p case 613af issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view l1 1 3 4 6 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.15 0.25 d 1.45 bsc e 1.00 bsc e 0.50 bsc l 0.25 0.35 l1 0.30 0.40 note 4 soldermask defined* dimensions: millimeters 0.30 5x 0.49 6x 1.24 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.50 1 mounting footprint pkg outline on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parame ters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 nlu2g16/d minigate is a trademark of semiconductor components industries, llc (scillc). literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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